Non Contact Sensor measurement of wafer thickness during CMP, Backgrinding process. Wafer Warpage Measurement. Wire loop and bond height measurement in 3D packaging.
The Precitec Group is the worldwide innovation and market leader in the development and manufacture of components and system solutions in the field of laser technology and optical metrology.
The Precitec Group is the worldwide innovation and market leader in the development and manufacture of components and system solutions in the field of laser technology and optical metrology.
